%0 Journal Article
%A James Kelly
%A Charan Surisetty
%A Donald Canaperi
%T Experimental study of copper leveling additives and their wafer and pattern-scale effect on copper planarization
%J Comptes Rendus. Chimie
%D 2013
%P 15-20
%V 16
%N 1
%I Elsevier
%R 10.1016/j.crci.2012.03.013
%G en
%F CRCHIM_2013__16_1_15_0