TY  - JOUR
AU  - James Kelly
AU  - Charan Surisetty
AU  - Donald Canaperi
TI  - Experimental study of copper leveling additives and their wafer and pattern-scale effect on copper planarization
JO  - Comptes Rendus. Chimie
PY  - 2013
SP  - 15
EP  - 20
VL  - 16
IS  - 1
PB  - Elsevier
DO  - 10.1016/j.crci.2012.03.013
LA  - en
ID  - CRCHIM_2013__16_1_15_0
ER  -