Comptes Rendus
Electron microscopy / Microscopie électronique
In situ mechanical TEM: Seeing and measuring under stress with electrons
[Voir et mesurer sous contrainte mécanique avec des électrons : La microscopie électronique à transmission (MET) in situ]
Comptes Rendus. Physique, Volume 15 (2014) no. 2-3, pp. 224-240.

Des premières observations du mouvement de dislocations en 1956 jusqu'aux derniers développements de porte-objets à commandes piézo-électriques et de caméras à détection d'électrons dans les microscopes électroniques à transmission (MET) modernes, les essais mécaniques in situ ont toujours permis une observation inégalée des mécanismes impliqués dans la déformation plastique. Bien que les porte-objets équipés d'une cellule de charge ou de MEMS offrent une visualisation presque directe de ces effets, l'élaboration des étapes nécessaires pour mesurer les relations entre contrainte et déformation à partir d'expériences réalisées in situ dans un MET a une longue histoire. Aujourd'hui, la réalisation d'un essai mécanique complet tout en observant l'évolution d'une structure de dislocations est possible ; ceci constitue la combinaison parfaite pour explorer les effets de taille dans la plasticité. Les nouvelles techniques intrinsèques d'imagerie (comme l'holographie en champ sombre) et l'accès à de nouveaux outils d'acquisition d'images (nouvelles caméras, taux d'acquisition rapides) vont étendre l'efficacité et les capacités de mesures sans entraver l'observation des mécanismes.

From the first observation of moving dislocations in 1956 to the latest developments of piezo-actuated sample holders and direct electron sensing cameras in modern transmission electron microscopes (TEM), in situ mechanical testing has brought an unequaled view of the involved mechanisms during the plastic deformation of materials. Although MEMS-based or load-cell equipped holders provide an almost direct measure of these quantities, deriving stress and strain from in situ TEM experiments has an extensive history. Nowadays, the realization of a complete mechanical test while observing the evolution of a dislocation structure is possible, and it constitutes the perfect combination to explore size effects in plasticity. New cameras, data acquisition rates and intrinsic image-related techniques, such as holography, should extend the efficiency and capabilities of in situ deformation inside a TEM.

Publié le :
DOI : 10.1016/j.crhy.2014.02.002
Keywords: In situ TEM, Plastic deformation, Dislocation structure and dynamics
Mot clés : Microscopie MET in situ, Déformation plastique, Structure et dynamique des dislocations

Marc Legros 1

1 CEMES–CNRS, 29, rue Jeanne-Marvig, 31055 Toulouse, France
@article{CRPHYS_2014__15_2-3_224_0,
     author = {Marc Legros},
     title = {In situ mechanical {TEM:} {Seeing} and measuring under stress with electrons},
     journal = {Comptes Rendus. Physique},
     pages = {224--240},
     publisher = {Elsevier},
     volume = {15},
     number = {2-3},
     year = {2014},
     doi = {10.1016/j.crhy.2014.02.002},
     language = {en},
}
TY  - JOUR
AU  - Marc Legros
TI  - In situ mechanical TEM: Seeing and measuring under stress with electrons
JO  - Comptes Rendus. Physique
PY  - 2014
SP  - 224
EP  - 240
VL  - 15
IS  - 2-3
PB  - Elsevier
DO  - 10.1016/j.crhy.2014.02.002
LA  - en
ID  - CRPHYS_2014__15_2-3_224_0
ER  - 
%0 Journal Article
%A Marc Legros
%T In situ mechanical TEM: Seeing and measuring under stress with electrons
%J Comptes Rendus. Physique
%D 2014
%P 224-240
%V 15
%N 2-3
%I Elsevier
%R 10.1016/j.crhy.2014.02.002
%G en
%F CRPHYS_2014__15_2-3_224_0
Marc Legros. In situ mechanical TEM: Seeing and measuring under stress with electrons. Comptes Rendus. Physique, Volume 15 (2014) no. 2-3, pp. 224-240. doi : 10.1016/j.crhy.2014.02.002. https://comptes-rendus.academie-sciences.fr/physique/articles/10.1016/j.crhy.2014.02.002/

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[123] J. Douin; F. Pettinari-Sturmel; A. Coujou Dissociated dislocations in confined plasticity, Acta Mater., Volume 55 (2007), pp. 6453-6458

[124] D. Caillard; J.L. Martin Thermally Activated Mechanisms in Crystal Plasticity, Pergamon Press, Cambridge, 2003

[125] M. Legros; G. Dehm; E. Arzt; T.J. Balk Observation of giant diffusivity along dislocation cores, Science, Volume 319 (2008), pp. 1646-1649

[126] F. Pettinari-Sturmel; G. Saada; J. Douin; A. Coujou; N. Clément Quantitative analysis of dislocation pile-ups in thin foils compared to bulk, Mater. Sci. Eng. A, Struct. Mater.: Prop. Microstruct. Process., Volume 387–389 (2004), pp. 109-114

[127] M. Chassagne; M. Legros; D. Rodney Atomic-scale simulation of screw dislocation/coherent twin boundary interaction in Al, Au, Cu and Ni, Acta Mater., Volume 59 (2011), pp. 1456-1463

[128] G. Saada; J. Douin; F. Pettinari-Sturmel; A. Coujou; N. Clément Pile-ups in thin foils: application to transmission electron microscopy analysis of short-range-order, Philos. Mag., Volume 84 (2006), pp. 807-824

[129] B. Pan; B. Pan; K. Qian; K. Qian; H. Xie; H. Xie et al. Two-dimensional digital image correlation for in-plane displacement and strain measurement: a review, Meas. Sci. Technol., Volume 20 (2009), p. 062001

[130] C. Eberl; D.S. Gianola; R. Thompson Digital Image Correlation and Tracking, The Mathworks, Inc., 2006

[131] D. Gianola; M. Legros; K.J. Hemker; W.J. Sharpe Experimental techniques for uncovering deformation mechanisms in nanocrystalline Al thin films, TMS Lett. (2004), pp. 149-150

[132] D.S. Gianola; A. Sedlmayr; R. Mönig; C.A. Volkert; R.C. Major; E. Cyrankowski et al. In situ nanomechanical testing in focused ion beam and scanning electron microscopes, Rev. Sci. Instrum., Volume 82 (2011), pp. 063901-063912

[133] F. Mompiou; D. Caillard; M. Legros Grain-boundary mediated plasticity in nanocrystalline Al films, San Francisco (2008)

[134] F. Mompiou; M. Legros; D. Caillard Direct observation and quantification of grain boundary shear-migration coupling in polycrystalline Al, J. Mater. Sci., Volume 46 (2011), pp. 4308-4313

[135] F. Mompiou; D. Caillard; M. Legros Grain boundary shear-migration coupling–I. In situ TEM straining experiments in Al polycrystals, Acta Mater., Volume 57 (2009), pp. 2198-2209

[136] J.W. Cahn; J.E. Taylor A unified approach to motion of grain boundaries, relative tangential translation along grain boundaries, and grain rotation, Acta Mater., Volume 52 (2004), pp. 4887-4898

[137] J.W. Cahn; Y. Mishin; A. Suzuki Coupling grain boundary motion to shear deformation, Acta Mater., Volume 54 (2006), pp. 4953-4975

[138] A. Rajabzadeh; F. Mompiou; M. Legros; N. Combe Elementary mechanisms of shear-coupled grain boundary migration, Phys. Rev. Lett. (2013), p. 265507

[139] G. Gottstein; D.A. Molodov; L.S. Shvindlerman; D.J. Srolovitz; M. Winning Grain boundary migration: misorientation dependence, Curr. Opin. Solid State Mater. Sci., Volume 5 (2001), p. 9

[140] A. Rajabzadeh; M. Legros; N. Combe Evidence of grain boundary dislocation step motion associated to shear-coupled grain boundary migration, Philos. Mag., Volume 93 (2013), pp. 1299-1316

[141] D. Caillard; F. Mompiou; M. Legros Grain-boundary shear-migration coupling. II: Geometrical model for general boundaries, Acta Mater., Volume 57 (2009), pp. 2390-2402

[142] M. Kim; J.M. Zuo; G.-S. Park High-resolution strain measurement in shallow trench isolation structures using dynamic electron diffraction, Appl. Phys. Lett., Volume 84 (2004), pp. 2181-2183

[143] M. Legros; O. Ferry; F. Houdellier; A. Jacques; A. George Fatigue of single crystalline silicon: Mechanical behaviour and TEM observations, Mater. Sci. Eng. A, Struct. Mater.: Prop. Microstruct. Process., Volume 483–484 (2008), pp. 353-364

[144] M.J. Hytch; J.L. Putaux; J.M. Pénisson Measurement of the displacement field of dislocations to 0.03 A by electron microscopy, Nature, Volume 425 (2003), pp. 270-273

[145] F. Hüe; M. Hÿtch; H. Bender; F. Houdellier; A. Claverie Direct mapping of strain in a strained silicon transistor by high-resolution electron microscopy, Phys. Rev. Lett., Volume 100 (2008), p. 156602

[146] M. Legros; F. Houdellier; M. Martinez; A. Danilov; L. De Knoop; M. Hÿtch In Situ dark field electron holography with a double tilt nano-indentation holder, Rio de Janeiro (2010)

[147] Web site, K. Ishizuka, GPA for DigitalMicrograph, www.hremresearch.com.

[148] E.A. Stach; D. Zakharov; R.D. Rivas; P. Longo; M. Lent; A. Gubbens et al. Exploiting a direct detection camera for in situ microscopy, Microsc. Microanal., Volume 19 (2013), pp. 392-393

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