[Voir et mesurer sous contrainte mécanique avec des électrons : La microscopie électronique à transmission (MET) in situ]
Des premières observations du mouvement de dislocations en 1956 jusqu'aux derniers développements de porte-objets à commandes piézo-électriques et de caméras à détection d'électrons dans les microscopes électroniques à transmission (MET) modernes, les essais mécaniques in situ ont toujours permis une observation inégalée des mécanismes impliqués dans la déformation plastique. Bien que les porte-objets équipés d'une cellule de charge ou de MEMS offrent une visualisation presque directe de ces effets, l'élaboration des étapes nécessaires pour mesurer les relations entre contrainte et déformation à partir d'expériences réalisées in situ dans un MET a une longue histoire. Aujourd'hui, la réalisation d'un essai mécanique complet tout en observant l'évolution d'une structure de dislocations est possible ; ceci constitue la combinaison parfaite pour explorer les effets de taille dans la plasticité. Les nouvelles techniques intrinsèques d'imagerie (comme l'holographie en champ sombre) et l'accès à de nouveaux outils d'acquisition d'images (nouvelles caméras, taux d'acquisition rapides) vont étendre l'efficacité et les capacités de mesures sans entraver l'observation des mécanismes.
From the first observation of moving dislocations in 1956 to the latest developments of piezo-actuated sample holders and direct electron sensing cameras in modern transmission electron microscopes (TEM), in situ mechanical testing has brought an unequaled view of the involved mechanisms during the plastic deformation of materials. Although MEMS-based or load-cell equipped holders provide an almost direct measure of these quantities, deriving stress and strain from in situ TEM experiments has an extensive history. Nowadays, the realization of a complete mechanical test while observing the evolution of a dislocation structure is possible, and it constitutes the perfect combination to explore size effects in plasticity. New cameras, data acquisition rates and intrinsic image-related techniques, such as holography, should extend the efficiency and capabilities of in situ deformation inside a TEM.
Mot clés : Microscopie MET in situ, Déformation plastique, Structure et dynamique des dislocations
Marc Legros 1
@article{CRPHYS_2014__15_2-3_224_0,
author = {Marc Legros},
title = {In situ mechanical {TEM:} {Seeing} and measuring under stress with electrons},
journal = {Comptes Rendus. Physique},
pages = {224--240},
publisher = {Elsevier},
volume = {15},
number = {2-3},
year = {2014},
doi = {10.1016/j.crhy.2014.02.002},
language = {en},
}
Marc Legros. In situ mechanical TEM: Seeing and measuring under stress with electrons. Comptes Rendus. Physique, Volume 15 (2014) no. 2-3, pp. 224-240. doi : 10.1016/j.crhy.2014.02.002. https://comptes-rendus.academie-sciences.fr/physique/articles/10.1016/j.crhy.2014.02.002/
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