Comptes Rendus
no. 7
Trends and perspectives in solid-state wetting / Mouillage solide–solide : tendances et perspectives
Analysis of a combined influence of substrate wetting and surface electromigration on a thin film stability and dynamical morphologies
[Analyse de lʼinfluence combinée du mouillage du substrat et de lʼélectromigration en surface sur la stabilité dʼune couche mince et les morphologies dynamiques]
Mikhail Khenner1
1 Department of Mathematics, Western Kentucky University, Bowling Green, KY 42101, USA
Comptes Rendus. Physique, Volume 14 (2013) no. 7, pp. 607-618.

Un modèle basé sur les équations aux dérivées partielles et qui combine lʼélectromigration de surface et le mouillage est developpé pour lʼanalyse de la stabilité morphologique de couches ultra-minces solides. La mobilité des adatomes est supposée anisotrope, et deux directions du champ électrique (parallèle et perpendiculaire à la surface) sont discutées et comparées. Des analyses de stabilité linéaire dʼéquations dʼévolution en approximation de petite inclinaison sont effectuées, suivies par des calculs dʼéquations dʼévolution complètement non linéaires et paramétriques, qui permettent des surplombs de surface. Les résultats révèlent des domaines de stabilité dans lʼespace des paramètres pour les couches mouillantes et non mouillantes, une intensité variable du champ électrique, des solutions non linéaires dʼéquilibre dans certains cas, ainsi quʼun comportement intéressant de grossissement pour les couches fortement mouillées.

A PDE-based model combining surface electromigration and wetting is developed for the analysis of morphological stability of ultrathin solid films. Adatom mobility is assumed anisotropic, and two directions of the electric field (parallel and perpendicular to the surface) are discussed and contrasted. Linear stability analyses of small-slope evolution equations are performed, followed by computations of fully nonlinear parametric evolution equations that permit surface overhangs. The results reveal parameter domains of instability for wetting and non-wetting films and variable electric field strength, nonlinear steady-state solutions in certain cases, and interesting coarsening behavior for strongly wetting films.

Publié le :
DOI : 10.1016/j.crhy.2013.06.009
Keywords: Electromigration, Wetting, Dynamics of thin solid films
Mot clés : Électromigration, Mouillage, Dynamique des couches minces solides
Mikhail Khenner 1

1 Department of Mathematics, Western Kentucky University, Bowling Green, KY 42101, USA 
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Mikhail Khenner. Analysis of a combined influence of substrate wetting and surface electromigration on a thin film stability and dynamical morphologies. Comptes Rendus. Physique, Volume 14 (2013) no. 7, pp. 607-618. doi : 10.1016/j.crhy.2013.06.009. https://comptes-rendus.academie-sciences.fr/physique/articles/10.1016/j.crhy.2013.06.009/

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