[La lithographie par écriture directe : solution globale pour la R&D et la production]
La lithographie par faisceau d'électrons est une solution technologique bien connue, mature et très utilisée dans les laboratoires de recherche et universités qui permet de réaliser des structures avancées pour des programmes de recherche et développement, couvrant un large champ d'applications. Cependant, du fait de sa lenteur d'écriture, la lithographie à écriture directe n'est jamais apparue comme une solution crédible pour la production. Néanmoins, l'accroissement des coûts de la lithographie optique liés à l'utilisation de masques et de systèmes d'exposition de plus en plus complexes, commence à toucher le marché des semi-conducteurs. Cette tendance ouvre des perspectives pour des machines de lithographie sans masque à fort débit pour la production de circuits spécifiques (ASIC). Une revue de la lithographie sans masque (ML2) est présentée dans cette publication, incluant la capacité d'intégration de cette solution, ses domaines d'application ainsi que les perspectives concernant des solutions ML2 à fort débit.
The electron beam lithography is a well known and mature solution, widely installed in research laboratories and Universities, to provide advanced patterning for research and development programs for a large field of applications. However, limited by its low throughput capabilities, the direct write solution never appeared as a credible option for manufacturing purposes. Nevertheless, semiconductor business starts to be affected by the increasing cost of the optical lithography requesting more and more complex masks and projection systems. This trend opens opportunities for high throughput mask less equipments to address ASIC manufacturing. A review of the Maskless Lithography (ML2) technology is presented in this article, including process integration capability, application fields and perspective for high throughput ML2 solution.
Mots-clés : Lithographie, Faisceau d'electron, Écriture directe, Prototypage
Laurent Pain 1 ; Serge Tedesco 1 ; Christophe Constancias 1
@article{CRPHYS_2006__7_8_910_0,
author = {Laurent Pain and Serge Tedesco and Christophe Constancias},
title = {Direct write lithography: the global solution for {R&D} and manufacturing},
journal = {Comptes Rendus. Physique},
pages = {910--923},
publisher = {Elsevier},
volume = {7},
number = {8},
year = {2006},
doi = {10.1016/j.crhy.2006.10.003},
language = {en},
}
TY - JOUR AU - Laurent Pain AU - Serge Tedesco AU - Christophe Constancias TI - Direct write lithography: the global solution for R&D and manufacturing JO - Comptes Rendus. Physique PY - 2006 SP - 910 EP - 923 VL - 7 IS - 8 PB - Elsevier DO - 10.1016/j.crhy.2006.10.003 LA - en ID - CRPHYS_2006__7_8_910_0 ER -
Laurent Pain; Serge Tedesco; Christophe Constancias. Direct write lithography: the global solution for R&D and manufacturing. Comptes Rendus. Physique, Ultimate lithography, Volume 7 (2006) no. 8, pp. 910-923. doi : 10.1016/j.crhy.2006.10.003. https://comptes-rendus.academie-sciences.fr/physique/articles/10.1016/j.crhy.2006.10.003/
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